Rugged GPGPU Computer with NVIDIA 768-CUDA cores


The SD-7RP1050GPU is a High Performance Embedded Computer (HPEC) based on NVIDIA Pascal GPU Architecture.The power of the GeForce™ GTX 1050Ti delivers unsurpassed graphics, video, and GPU computing performance, with access to 768 NVIDIA CUDA™ cores. It is an ideal solution for performance driven systems such as defense and military/aerospace applications.

• NVIDIA® GeForce™ GTX 1050Ti (768CUDA Cores)
• Intel® 6th Generation Core™ / Xeon® E3 v5 Family Processor
• Up to 32GB dual channel ECC DDR4 at 2133 MHz
• 6x Independent video outputs ,DisplayPort/HDMI/DVI (Outputs selection by request)
• DVI/HDMI , HD-SDI and 4 x Composite inputs (Optional)
• Up to 2TB Solid State Storage in removable canister with rugged SATA connector
• 2 x Gigabit Ethernet LAN Interfaces (10/100/1000Mbps)
• 3 x RS232, 2 x RS485 ; 4x USB 3.0, 6x USB 2.0
• GPIO 4 in /4 out
• HD Audio:1 stereo input, 1 stereo output
• All I/O ports through MIL 38999 Connectors
• Remote power on/off and reset whole system option
• Wide operating temperature -35 to +65°C
• Full IP67 water dust proof, anti-corrosion housing
• Windows™ and Linux Support


Processor & RAM

  • Intel® 6th Gen.  Xeon® E3 v5 Family E3-1505L v5 Processor
  • DDR4-2133 up to 32GB ECC


  • NVIDIA® GeForce™ GTX 1050Ti  (768 CUDA Cores)

Video Input

  • 6x Independent DisplayPort /HDMI /DVI outputs (Outputs selection by request)

Network interface

  • 2x Gigabit Ethernet      
  • miniPCIe slot for optional WiFi or 4G Modem


  • Up to 2TB Solid State Storage in removable canister with rugged SATA connector

Power Requirements:

  • Wide range input +18V to +36V DC
  • Reverse polarity protection. Overload protection and transient voltage suppression


  • Full IP67 water dust proof, anti-corrosion housing
  • Operating temperature: -35ºC to +65ºC
  • Storage temperature : -40°C to 80°C
  • Operational Altitude (20,000ft) MIL-STD-810G, Method 500.5, Procedure II.
  • Humidity: MIL-STD-810G, Method 507.5, and Procedure II.
  • Sand and Dust: MIL-STD-810G, Method 510.5 Procedure I (Dust) & II (Sand).
  • Fungus: MIL-STD-810G, Method 508.6.
  • Vibration: MIL-STD-810G method 514.6, procedure I.
  • Mechanical Shock: MIL-STD-810G, Method 516.6 Procedure I & V.
  • EMC /EMI : MIL-STD-461F CE101,CE102, CS101, CS114, CS116, RE101,RE102.